中国因长期缺“芯”而遭受全球价值链“低端锁定”之痛。如何克服开放与自主可控的“创新悖论”,成为打造中国“芯”的关键难题。本报告以华为海思芯片的自主创新探索为例,分析了华为海思在芯片技术创新方面从跟跑、并跑到领跑的自主创新突围之路,基于整合式创新等相关理论,提出中国企业要从封闭自主创新走向基于自主的开放、协同与整合式创新,加快制造业关键核心技术“卡脖子”问题的突破和超越,为实现创新引领高质量发展提供借鉴和参考。
<<Chip is not only the foundation of modern ICT industry,but also one nation’s “industrial grain” and the commanding height of international competition. Although China is the world’s largest chip market,Chinese suffers from “low-end locking” in the global value chain due to the long-term lack of domestic chip innovation capability. How to build a strong “Chinese Core” is vital for dealing with the “bottleneck” challenge,improving the Chinese firms’ competitivenessand buildingthe global innovation powerhouse. As chip industry is a globalized industry,under the new wave of technological revolution,the organization and industry boundaries are blurred,and the competition is more and more eco-based. It is hard to achieve chip industry indigenous innovation only depends on one single firm,by contrast,firms have to follow the trend of open innovation. However,how do deal with the “innovation paradox” between openness and independence becomes the critical problem of building the domestic “core”. This case takesHiSilicon’s indigenous innovation in the era of open innovation as an example,which truly reviews the whole process of HiSilicon’s indigenous innovation from following,catch-up and leading in IC industry. This case provide a meaningful exploration of firm’s indigenous innovation in the era of open innovation for researchers,students and practitioners to understand and master the theoretical content such as innovation strategy,indigenous innovation process,the connotation of “open based on indigenous” and “indigenous under open environment”,the open innovation paradox. It also generates insights for Chinese firms to transit from closed indigenous innovation to indigenous-based open,collaborative and holistic innovation,for China to speed up the breakthrough of key technologies and go beyond catch-up,so as to achieve high-value manufacturing and high-quality development.
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