氮化镓(GaN)材料是宽禁带材料的一种,适于制造高频大功率、耐高温、抗辐射半导体微电子器件等,在军民两用领域均有巨大的应用前景。经过自21世纪以来美国等国家的持续推动,GaN器件和工艺技术快速成熟,产品大量上市,并已用于多个在研武器中。GaN器件已在性能、尺寸、可靠性和成本间取得平衡,并开始逐步替代市场上成熟的砷化镓(GaAs)和硅横向扩散金属氧化物半导体(LDMOS)器件,市场前景极其广阔。
<<Gallium nitride(GaN)material is a kind of wide bandgap material,suitable for manufacturing high frequency,high power,high temperature resistant,radiation resistant semiconductor microelectronic devices,etc. It has great application prospects in both military and civilian fields. After continuous promotion in the United States and other countries since the 21st century,GaN devices and process technologies have matured rapidly,and a large number of products have been launched,and have been used in many weapons under research. GaN devices have balanced performance,energy efficiency,size,reliability,and cost,and have replaced the market for mature GaAs and silicon laterally diffused metal oxide semiconductors(LDMOS).
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