As a traditional field in the semiconductor industry，the packaging and testing industry has evolved with the development of semiconductor technology. Nowadays，the purpose of integrated circuit packaging is not only to save space and protect internal structures，but has begun to transform into the need for improving the performance of the device. Choosing the right package method to improve performance has become more and more challenging. In the future，advanced packaging technology will dominate the integrated circuit packaging and testing market development direction，and integrated circuit packaging will move toward miniaturization and lightness. However，with the increasing complexity of integrated circuit design，advanced packaging faces more and more challenges.